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Model X3C09P2-03S
Rev D
Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
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Internal circuit temperature.
Unit mounting interface temperature.
Unit thermal resistance
Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
Maximum mounting interface temperature is 95 C.
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The unit has reached a steady state operating condition.
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Conduction Heat Transfer through the mounting interface.
No Convection Heat Transfer.
No Radiation Heat Transfer.
The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
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Unit material stack-up.
Material properties.
Circuit geometry.
Mounting interface temperature.
Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta ( ? T) divided by thermal resistance (R). The
dissipated power (P dis ) can also be calculated as a function of the total input power (P in ) and the thermal insertion loss
(IL therm ):
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P dis =
? T
R
? IL therm
= P in ? ? ? 1 ? 10 10
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( W )
(1)
Power flow and nomenclature for an “X” style coupler is shown in Figure 1.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe :
(315) 432-8909
(800) 411-6596
+44 2392-232392
相关PDF资料
X3C09P2-30S COUPLER 90DEG 800-1000MHZ 30DB
X3C19E2-20S COUPLER 90DEG 1700-2000MHZ 20DB
X3C19P1-03S COUPLER 90DEG 1700-2000MHZ 3DB
X3C19P2-03S COUPLER 90DEG 1700-2000MHZ 3DB
X3C19P2-30S COUPLER 90DEG 1700-2000MHZ 30DB
X3C21P1-03S COUPLER 90DEG 2000-2300MHZ 3DB
X3C21P2-03S COUPLER 90DEG 2000-2300MHZ 3DB
X3C26P1-03S COUPLER 90DEG 2650-2800MHZ 3DB
相关代理商/技术参数
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